Home Articles Abstract
Research Article

Decision making on application of new technology on manufacturing- the case of semiconductor packaging

Taesoon Jang1 · SunJin Son1 · Chaisung Lim2 · Kwangsoo Kim2

1 Amkor Technology Korea, 2 Konkuk University

Published: January 2015 · Vol. 19, No. 1 · pp. 33-56
Full Text

Abstract

R Korea, a subsidiary of R multinational company, has developed low cost copper wire bonding technology in order to substitute the gold wire bonding technology, for strengthening the cost competitiveness of R in the world competition. The performance of the copper wire bonding technology does not reveal innovatively high performance. The main market customers, in advanced countries, are less likely to adopt the packaged semiconductors through copper wire bonding than the peripheral market customers in South East Asia and China. Therefore the divisions ranging from R&D to manufacturing show conflicting opinions on applying the technology into the manufacturing process. The case offers opportunity to learn relevant issues on decision making on whether the firm should make strategic decision to accept the new technology from its expectations on future progress of technology and decision making through reviewing various opinions of the divisions. Students can learn the issues in technology innovation management strategy and technology innovation process management for integrating various opinions of the divisions.
Keywords: 반도체기술개발기술 전략개발 프로세스 관리조직간 의사소통